A study of electrochemical kinetics of copper deposition under pulsed current conditions |
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Authors: | C. C. Wan H. Y. Cheh H. B. Linford |
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Affiliation: | 1. Department of Industrial Chemistry, National Tsing Hua University, Hsinchu, Taiwan, ROC 2. Department of Chemical Engineering and Applied Chemistry, Columbia University, New York, USA
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Abstract: | The investigation is concerned with the drop of current efficiency (CE) of copper deposition under pulsed current conditions. A mathematical model which is based on different charge transfer rates between the following two reactions, (1) $$Cu^{2 + } + e to Cu^ + $$ and (2) $$Cu^ + + e to Cu$$ has been formulated to describe the behaviour of a Cu/CuSO4 system under pulsed current conditions on a rotating disc electrode. The results indicate that the CE drops continuously as the difference between the exchange current densities of the two reactions increases. The exchange current densities of Reactions 1 and 2 were estimated to be 0.034 mA cm?2 and 0.024 mA cm?2, respectively. Prediction of CE using the mathematical model agreed to within 3.5% with experimental data over a range 80.4–93.7%. |
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