Interfacial Reactions of Sn-8wt.%Zn-3wt.%Bi Solder
with Cu,Ag, and Ni Substrates |
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| Authors: | Ching-Feng Yang Sinn-Wen Chen Kuan-Hsien Wu Tsung-Shune Chin |
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| Affiliation: | (1) Department of Chemical Engineering, National Tsing Hua University, #101, Sec. 2, Kuang-Fu Road, Hsin-Chu, 300, Taiwan;(2) Department of Materials Science and Engineering, National Tsing Hua University, #101, Sec. 2, Kuang-Fu Road, Hsin-Chu, 300, Taiwan |
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| Abstract: | Sn-Zn-Bi alloys are promising Pb-free solders. Interfacial reactions between the Sn-8wt.%Zn-3wt.%Bi (Sn-13.80at.%Zn-1.62at.%Bi)
alloy and the Cu, Ag, and Ni substrates are examined. Two different kinds of substrates, the bulk plate and the electroplating
layer, are used, and the reactions are carried out at 250°C and 220°C. Although the Zn content is only 13.8 at.%, two Zn-Cu
compounds, γ-Cu5Zn8 and ε-CuZn5 phases, are formed in the Sn-13.80at.%Zn-1.62at.%Bi/Cu couples. The ε-CuZn5 phase is scallop shaped, and the γ-Cu5Zn8 phase is planar. In the Sn-13.80at.%Zn-1.62at.%Bi/Ag couples, three Zn-Ag compounds are observed, and they are ε-AgZn3, γ-Ag5Zn8, and ζ-AgZn phases. In the Sn-13.80at.%Zn-1.62at.%Bi/Ni couples, a Zn-Ni compound, γ-Ni5Zn21 phase, is formed. Similar results are found in the couples prepared with an electroplating layer: the reaction phases are
the same, but the growth rates are different. |
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| Keywords: | Pb-free solder interfacial reaction Zn |
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