| 磁控溅射法制备铁氧体薄膜的界面结合强度研究 |
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| 引用本文： | 徐小玉,黄之德.磁控溅射法制备铁氧体薄膜的界面结合强度研究[J].真空,2010,47(1). |
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| 作者姓名： | 徐小玉 黄之德 |
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| 作者单位： | 常州轻工职业技术学院,江苏,常州,213164 |
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| 摘 要： | 利用磁控溅射法在单硅晶基底和玻璃基底上沉积铁氧体薄膜,采用AFM观察薄膜的微观形貌,采用划痕法测试薄膜的界面结合强度,测试结果表明:由于两种不同材质上沉积的薄膜粗糙度缘故,硅晶/铁氧体薄膜的临界载荷为19.7N,其划痕形貌为裂纹状扩展,玻璃/铁氧体薄膜的临界载荷为5.3N,其划痕形貌为剥落状。
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| 关 键 词： | 铁氧体薄膜 界面结合强度 划痕法 |
Study on interfacial adhesion strength of ferrite film deposited by magnetron sputtering |
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| XU Xiao-yu,HUANG Zhi-de.Study on interfacial adhesion strength of ferrite film deposited by magnetron sputtering[J].Vacuum,2010,47(1). |
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| Authors: | XU Xiao-yu HUANG Zhi-de |
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| Affiliation: | XU Xiao-yu,HUANG Zhi-de(Changzhou Institute of Light Industry Technology,Changzhou 213164,China) |
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| Abstract: | The ferrite thin films were deposited on monocrystalline silicon and glass substrates by magnetron sputtering.Their morphologies were observed by AFM with the interfacial adhesion strength between film and substrate tested by scratch test.The results showed that because of the different surface roughnesses of the two types of substrates,the scratched crack propagates on ferrite film deposited on silicon substrate when the critical load is 19.7N,but the film deposited on glass substrate is spalled from the s... |
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| Keywords: | ferrite film interfacial adhesion strength scratch test |
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