Study on reaction kinetics of epoxy resin cured by a modified dicyandiamide |
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| Authors: | Libang Feng Yulong Wang Yanping Wang Hao Liu Jianchang Zhao |
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| Affiliation: | 1. Key Laboratory of Road Bridge and Underground Engineering of Gansu Province, Lanzhou Jiaotong University, Lanzhou 730070, People's Republic of China;2. Gansu Chengtai Prestressing Technology Engineering Technology Co., LTD, Lanzhou 730050, People's Republic of China |
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| Abstract: | To improve the disadvantage of the low reactivity and reduce the high curing temperature of epoxy resin cured by dicyandiamide (DICY), DICY is chemically modified with phenyl hydrazine and a new curing agent, LB‐A, is developed in this research. The structure, the curing behavior, and reaction kinetics of LB‐A curing epoxy resin are investigated. Results show that the DICY is modified successfully and the well‐defined structure of DICY is destroyed after modification. Consequently, a new curing agent in a noncrystal form is resulted. Thereupon, the reactivity and compatibility between the epoxy resin and the curing agent are improved appreciably using LB‐A instead of DICY. Meanwhile, the curing temperature and activation energy of the curing reaction decrease outstanding, whereas the rate constant increases remarkably. In addition, the compressive strength and the adhesive strength in shear by tension loading of the resulting epoxy resins have been increased using LB‐A instead of DICY as the curing agent. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013 |
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| Keywords: | epoxy resin dicyandiamide kinetics modification mechanism |
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