首页 | 本学科首页   官方微博 | 高级检索  
     


A polyurethane‐based nanocomposite biocompatible bone adhesive
Authors:Kevin J. Schreader  Ilker S. Bayer  Derek J. Milner  Eric Loth  Iwona Jasiuk
Affiliation:1. Department of Mechanical Science and Engineering, University of Illinois at Urbana‐Champaign, Urbana, Illinois 61801;2. Center for Biomolecular Nanotechnologies@UNILE, Smart Materials Platform, Istituto Italiano di Tecnologia, Arnesano, LE 73010, Italy;3. Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904;4. The Institute for Genomic Biology, Regenerative Biology and Tissue Engineering Theme, University of Illinois at Urbana‐Champaign, Urbana, Illinois 61801
Abstract:A novel polyurethane‐based foam‐like adhesive reinforced with nanosized hydroxyapatite (HA) particles was developed and investigated for bone‐to‐bone bonding applications in terms of mechanical adhesion and biocompatibility. The adhesive has a hierarchical structure with HA particles at the nanoscale level and pores at the micro‐scale level. This adhesive was tested mechanically in the three principal loading modes anticipated: shear, tension, and compression. Standard testing procedures were used when available. Tensile strength of primed adhesive showed a four‐fold increase in adhesion on unmodified bone and a nearly two‐fold increase in adhesion to primed bone as compared with the conventional bone cement. Biocompatibility was initially assessed in vitro using cell culture tests, which showed positive interaction with the adhesive. Then, a second biocompatibility test was performed using Xenopus laevis limbs to assess an in vivo response. The results indicated that the adhesive material produces a normal response consistent with control specimens. However, long‐term observations and tests with additional species are needed to demonstrate full biocompatibility. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2013
Keywords:adhesion  bone repair  nanocomposite  polyurethane  hydroxyapatite particles
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号