多层集成电路中缺陷地引起的寄生基板模式

针对多层集成电路中由于共地面开窗引起的寄模问题，通过对比“窗口遮挡”形式和多种背孔阵列抑制寄生模传播效果，发现“窗口遮挡”形式在有效抑制寄生模传播的同时会极大地增加电路损耗，存在最简背孔阵列可以达到抑制寄生模传播的效果。在不改变工艺结构的前提下，“双背孔”和“四背孔”形式可以分别满足200 GHz/300 GHz以下介质膜抑制需求，此时背孔所占面积最小，可以有效减小背孔排列密度，增加电路集成度。

Parasitic modes caused by defect ground structure in multilayer integrated circuit

In multilayer integrated circuit, the parasitic mode problem is caused by Defect Ground Structure(DGS).By comparing the effects of window shielding form and various back hole arrays in suppressing the propagation of parasitic modes, it is found that the window shielding form can effectively suppress the propagation of parasitic modes but greatly increase the circuit loss. The existence of the simplest back hole array can achieve parasitic suppression. Without changing the process structure, the double-back-hole form and the four-back-hole form can meet the suppression requirements of dielectric films below200 GHz and 300 GHz respectively. In these cases, the back holes occupy the smallest area. It can effectively reduce the back hole arrangement density and increase the circuit integration.