Interfacial Microstructural Evolution and Metallurgical Bonding Mechanisms for IN718 Superalloy Joint Produced by Hot Compressive Bonding

The novel metallurgical joining process for bonding IN718 superalloy was investigated by hot compressive bonding (HCB) process under the deformation temperature range of 1000 °C to 1150 °C and true strains ranging from 0 to 0.5 at a strain rate of 0.001 s^?1. The effect of HCB process parameters on the tensile strength was analyzed. Both the as-deformed and the interfacial microstructures were characterized using the optical microscope, electron backscattered diffraction and transmission electron microscope (TEM) analysis. The results of tensile property revealed that the degree of metallurgical bonding is promoted by increasing deformation temperature and strain. The evolution of the interfacial microstructure showed that the migration of interfacial grain boundary (IGB), which is characterized by discontinuous dynamic recrystallization, is the dominant metallurgical bonding mechanism in the early stages of bonding. TEM analysis indicated that the dislocation density is distributed heterogeneously over both sides of IGB, which is the significant reason for the migration of IGB, during the initial stage of HCB process.