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多晶硅高温压力传感器的芯片内温度补偿!
引用本文:庞科,张生才,姚素英,张为. 多晶硅高温压力传感器的芯片内温度补偿![J]. 传感技术学报, 2004, 17(1): 118-121
作者姓名:庞科  张生才  姚素英  张为
作者单位:天津大学,专用集成电路设计中心,天津,300072
摘    要:提出了一种新的改善传感器温度特性的方法.通过在压力传感器芯片上集成多晶硅电阻网络与温度传感器,借助传感器信号处理单元,可以方便地实现对灵敏度系数的补偿.经过补偿,传感器的零点温漂达到1×10-4/℃,灵敏度温漂低于-2×10-4/℃.这种方法补偿的温区宽,具有很强的通用性,使高温压力传感器十分有效的温度补偿方法.

关 键 词:多晶硅高温压力传感器  温度补偿  灵敏度  掺杂浓度
文章编号:1004-1699(2004)01-0118-04
修稿时间:2003-08-29

On-Chip Temperature Compensation Technology of High-Temperature Polysilicon Pressure Sensor
PANG Ke,?? ZHANG Sheng??cai,YAO Su??ying,ZHANG Wei. On-Chip Temperature Compensation Technology of High-Temperature Polysilicon Pressure Sensor[J]. Journal of Transduction Technology, 2004, 17(1): 118-121
Authors:PANG Ke  ?? ZHANG Sheng??cai  YAO Su??ying  ZHANG Wei
Affiliation:ASIC Design Center of Tianjin Univ . , Tianjin 300072, China
Abstract:A new method to improve the temperature dependence of polycrystalline silicon pressure sensor is presented.By means of integrating polycrystalline silicon resistor network and a temperature sensor on chip, the temperature coeffi??cient of offset ( TCO) and sensitivity (TCS) of the sensor are effectively compensated to 1 ?? 10- 4 / and- 2 ?? 10- 4 / ,respectively. Showing advantages of wide compensating range and good compatibility, this method is a quite practical wayfor temperature compensation of the high temperature piezoresistive pressure sensor.
Keywords:high-temperature polycrystalline stalline silicon pressure sensor  temperature independence  sensitivity  doping concentration
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