| IC芯片粘片机并联焊头机构的静刚度分析 |
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| 引用本文： | 彭卫东,陈新,李克天,郑德涛,敖银辉. IC芯片粘片机并联焊头机构的静刚度分析[J]. 机械设计与研究, 2006, 22(2): 100-102 |
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| 作者姓名： | 彭卫东 陈新 李克天 郑德涛 敖银辉 |
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| 作者单位： | 1. 广东工业大学,机电工程学院,广州,510090;黄淮学院,河南,驻马店,463000
2. 广东工业大学,机电工程学院,广州,510090 |
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| 基金项目： | 中国科学院资助项目;教育部科学技术基金;广东省博士启动基金;广东省博士启动基金;广东省广州市科技攻关项目 |
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| 摘 要： | 针对所设计的IC芯片粘片机的并联焊头机构,建立了机构的静刚度模型。使用M atlab软件绘出了机构在整个工作区间的静刚度特性曲线,并对左右驱动部分和连杆的刚度对其影响进行了分析。根据这些曲线,说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。
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| 关 键 词： | 并联焊头机构 静刚度 刚度矩阵 特性曲线 |
| 文章编号： | 1006-2343(2006)02-100-03 |
| 收稿时间： | 2005-08-23 |
| 修稿时间： | 2005-08-23 |
Static Stiffness Analysis for the Parallel Bonding Mechanism of IC Chip Die |
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| PENG Wei-dong,CHEN Xin,LI Ke-tian,ZHENG De-tao,AO Yin-hui. Static Stiffness Analysis for the Parallel Bonding Mechanism of IC Chip Die[J]. Machine Design and Research, 2006, 22(2): 100-102 |
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| Authors: | PENG Wei-dong CHEN Xin LI Ke-tian ZHENG De-tao AO Yin-hui |
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| Affiliation: | 1. Guangdong University of Technology, Guangzhou 510090, China; 2. Huanghuai college, Henan zhumadian 463000, China |
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| Abstract: | Based on the designed parallel bonding mechanism of IC chip die, the statie stiffness model is established. Static stiffness characteristic curves are drawn in whole working area through Matlab software, and infection created by the left/right driving parts and connecting rods is analyzed. It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves. |
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| Keywords: | parallel bonding mechanism static stiffness stiffness matrix characteristic curves |
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