片上集成光学传感检测技术的研究进展（特邀）

光学传感检测技术因具有精度高、低延时和可成像等优势而得到广泛应用。随着大数据和物联网等信息技术的迅速发展，对检测平台小型化和便携性的需求日益迫切。为了克服现有技术对大型专用设备的依赖，提高对现场快检、轻载荷平台等应用场景的适用性，近年来，基于微纳光学的片上集成光学传感检测技术受到了极大关注。通过集成光源、光学传感单元与光电探测单元、以及发展片上光色散等技术，可以有效地实现光学传感信号提取和光电信号转换的片上集成，从而实现系统的微型化和多功能集成。文中介绍了相关技术原理和技术发展现状，分析了现有技术的优缺点，讨论并总结了未来的发展方向和应用前景。

Research progress of on-chip integrated optical sensing technology (Invited)

Optical sensing technology has been widely used because of its advantages of high precision, low delay and imaging. With the rapid development of information technology such as big data and Internet of things, the demand for miniaturization and portability of optical detection and inspection platform is becoming more and more urgent. In order to overcome the dependence on large-scale special equipment and improve the applicability of on-site rapid detection and light-load platform application scenarios, in recent years on-chip integrated optical sensing technology has attracted great attention. With the integration of optical source, optical sensing and photoelectric detection units, as well as the development of on-chip light dispersion technology, the on-chip integration of optical sensing signal extraction and photoelectric signal conversion can be effectively realized, which contributes to the realization of the miniaturization and multi-functional integration. The relevant technical principles and technology development status were introduced, the pros and cons of the existing techniques were discussed, and the future development direction and application prospects were summarized.