温度对无铅焊锡膏活性剂与Sn0.3Ag0.7Cu反应规律的影响

以MPEG400为溶剂,将定量锡块放入添加不同活性剂的溶液中加热保温,保温时间为1 h,考察锡块的质量变化,以研究不同温度下活性剂与焊锡材料的反应程度,进而用SEM进行反应形貌验证。实验结果表明,苹果酸在150℃以后与Sn0.3Ag0.7Cu焊锡材料反应强烈;丙二酸在100℃时与Sn0.3Ag0.7Cu焊锡材料的反应强于其他温度,125℃以后,随着温度的升高,反应反而减弱;三乙醇胺与Sn0.3Ag0.7Cu焊锡材料之间有微弱反应,随温度升高,反应强度增大。探讨温度对无铅焊锡膏用活性剂与Sn0.3Ag0.7Cu焊锡材料之间反应规律的影响,对助焊剂的研究具有重要指导意义。

Effect of Temperature on Reaction Rules between Active Agent used in Lead-free Solder Paste and Solder Material of Sn0.3Ag0.7Cu

Add a certain tin into the solvent which contained MPEG400 and a variety of active agent, and the time of heat preservation is one hour. Examine the quality change of tin, confirm the reaction degree of active agent and solder materials under different temperature, and then check the reaction profile by SEM. The experiment results show that： malic acid and solder material of Sn0.3Ag0.7Cu occur acute chemical reaction when the temperature is above 150℃; malonic acid and solder material of Sn0.3Ag0.7Cu have the maximum reaction activity at 100℃, and when the temperature is above 125℃, the activity decreased; triethanolamine solder material of Sn0.3Ag0.7Cu alleviate chemical reaction, and the reaction activity increases with rising temperature. Discusse the effect of temperature on reaction rules between active agent and solder material of Sn0.3Ag0.7Cu, has important guiding significance for research on soldering flux.