| 环氧基的PCB对无铅组装的兼容性 |
| |
| 引用本文： | 丁志廉.环氧基的PCB对无铅组装的兼容性[J].印制电路信息,2006(4):44-51,70. |
| |
| 作者姓名： | 丁志廉 |
| |
| 摘 要： | 综述了环氧树脂基的PCB与无铅化组装的兼容性问题。经过大量试验表明,常规的FR-4基材和双氰胺固化的高Tg基材是不能满足无铅化组装要求的,而采用酚醛固化的中等-Tg的环氧树脂基材是可能成为无铅化组装用基材的。同时,PCB制造过程也起着重要的作用。PCB设计和再(回)流焊的加热梯度也影响着无铅化的性能。
|
| 关 键 词： | 无铅化组装 双氰胺-固化环氧基材 常规FR-4 高Tg-FR-4 酚醛-固化环氧基材 再(回)流焊循环 |
Compatibility of Expoxy-based PCBs to Lead-free Assembly |
| |
| Ding Zhilian.Compatibility of Expoxy-based PCBs to Lead-free Assembly[J].Printed Circuit Information,2006(4):44-51,70. |
| |
| Authors: | Ding Zhilian |
| |
| Affiliation: | Ding Zhilian |
| |
| Abstract: | This paper summarizes the compatibility of epoxy-based PCB and lead-free assembly .A large number oftest show the standard-FR-4 base material and dicy-cured epoxy material of high-Tg is not a base material for lead-freeassembly,phenolic-cured epoxy material have the potential to solve this problem.But PCBmanufacturing plays animportant role.PCB design and the heating gradient in reflow also influence the lead-free assembly performance. |
| |
| Keywords: | lead-free assembly dicy-cured epoxy base material standard-FR-4 high Tg-FR-4phenolic-cured epoxy base material reflow cyclis |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
