| 压电陶瓷片全光亮可焊性化学镀工艺 |
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| 引用本文： | 陈湘灵,肖耀坤,姜知水.压电陶瓷片全光亮可焊性化学镀工艺[J].电镀与涂饰,1999,18(3):30-31,53. |
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| 作者姓名： | 陈湘灵 肖耀坤 姜知水 |
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| 作者单位： | 广州市1003信息35分箱,广东,广州,510310 |
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| 摘 要： | 研究了一种用于压电陶瓷片全光亮的化学镀工艺，代替传统二次涂覆银工艺，在降低生产成本、保护良好的可焊性、提高生产效率和产品外观等方面取得了满意效果。
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| 关 键 词： | 压电陶瓷片 可焊性 化学镀 |
Bright Weldable Electroless Ni-Sn-P Plating Process for Piezoelectric Ceramics Tablet |
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| CHEN Xiang-ling,XIAO Yao-kun,JIANG Zhi-shui.Bright Weldable Electroless Ni-Sn-P Plating Process for Piezoelectric Ceramics Tablet[J].Electroplating & Finishing,1999,18(3):30-31,53. |
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| Authors: | CHEN Xiang-ling XIAO Yao-kun JIANG Zhi-shui |
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| Abstract: | Full bright electroless nickel-tin-phosphorus plating process instead of traditional double silver dip-coating process for piezoelectric ceramic tablets was presented. It is satisfactory with low cost, good weldability, high production efficiency and excellent appearance. |
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| Keywords: | piezoelectric ceramics weldability electroless plating |
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