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Thermal residual stress of polycrystalline diamond compacts |
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| Authors: | CHEN Feng XU Gen MA Chun-de XU Guo-ping Testing Center Central South University Changsha China School of Resources Safety Engineering King-ray New Materials Science&Technology Co Ltd Changsha |
| Affiliation: | CHEN Feng1,XU Gen2,MA Chun-de1,XU Guo-ping3 1.Testing Center,Central South University,Changsha 410083,China,2.School of Resources , Safety Engineering,3.King-ray New Materials Science&Technology Co.,Ltd.,Changsha 410012 |
| Abstract: | Thermal residual stresses in polycrystalline diamond compact(PDC)cutter arising from the difference in thermal expansion between the polycrystalline diamond(PCD)and the supporting tungsten carbide substrate after sintering at high pressure and high temperature were investigated using finite element simulation,laboratory tests and theoretical analysis.The obtained results show that although compressive residual stresses exist both in the interface of PCD table and in the most region of PCD table surface, the... |
| Keywords: | polycrystalline diamond compact diamond thermal residual stress stress release |
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