Comparison of bonding procedures for 3D-structured polyimide films on silicon substrates applied to ink-jet cartridges |
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Authors: | T Goettsche C Ruddy U Heller M Stehr H Ashauer T Lindemann P Koltay Y Yu R-P Peters P Soriani A Bellone |
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Affiliation: | (1) HSG-IMIT, Villingen-Schwenningen, Germany;(2) IMTEK, University of Freiburg, Freiburg, Germany;(3) Boehringer Ingelheim MicroParts GmbH, Dortmund, Germany;(4) Olivetti I-Jet, Arnad, Italy |
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Abstract: | Established bubble-jet printheads consist of an assembly of three layers, which are a CMOS substrate, a channel layer and
a nozzle layer. The aim of the presented work was to simplify the setup of bubble-jet printheads by means of integrating channel
and nozzle structures in one single three-dimensional laser-structured polyimide nozzle plate. Different bonding techniques
for an assembly onto 1/3 inch standard CMOS printhead substrates are validated. The main challenges are a variety of bonding
materials, an alignment accuracy of <5 μm and the prevention of blocking the 20 μm deep fluidic channels in the polyimide
which have minimal lateral dimensions of 10 μm and a minimal pitch of 15 μm. In total, three bonding techniques, with and
without additional adhesion layers, were developed and evaluated. One method applies a 4 μm thick layer of Epotec 353ND (Polytec),
a standard two-component epoxy, in a specifically adapted rolling manner onto the film that is subsequently aligned to the
silicon chip using a flip-chip-bonder. Screen-printing and dispensing processes of adhesives were investigated but failed
due to insufficient structural resolution. The second method uses photolithographic processes to produce structured adhesion
preforms in SU-8 resist. With a layer thickness of 3 μm and an adapted curing schedule, promising results concerning resolution
and contour accuracy were obtained. Thirdly, bonding without additional adhesion layers was achieved in a micro-sealing process
that takes advantage of the highly defined thermoplastic softening of polyimide KJ (DuPont). The different processes were
compared regarding to yield, printing behavior of the assembled printheads and applicability to high volume productions. The
hereby developed adhesion technology was applied on the assembly of large one inch printheads for special applications. |
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Keywords: | Polyimide Micro-sealing Adhesion preforms SU-8 Print-head Multi-material |
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