| 钨金属化与氧化铝陶瓷高温共烧 |
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| 引用本文： | 邹勇明,吴金岭,郑宏宇. 钨金属化与氧化铝陶瓷高温共烧[J]. 真空电子技术, 2004, 0(4): 20-23 |
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| 作者姓名： | 邹勇明 吴金岭 郑宏宇 |
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| 作者单位： | 中国电子科技集团公司第十三研究所,封装专业部,河北,石家庄,050002 |
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| 摘 要： | 阐述了钨金属化与氧化铝陶瓷高温共烧工艺的特点,分析了烧结过程中温度曲线和露点等工艺参数对钨金属化与瓷件结合强度、密封气密性和收缩率的影响。通过反复的试验和烧结机理分析对比,给出了最佳的控制参数。
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| 关 键 词： | 高温共烧 钨金属化 露点 |
| 文章编号： | 1002-8935(2004)04-0020-04 |
| 修稿时间： | 2004-06-29 |
Tungsten Metallization and Alumina High Temperature Co-Firing |
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| ZOU Yong-ming,WU Jin-ling,ZHENG Hong-yu. Tungsten Metallization and Alumina High Temperature Co-Firing[J]. Vacuum Electronics, 2004, 0(4): 20-23 |
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| Authors: | ZOU Yong-ming WU Jin-ling ZHENG Hong-yu |
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| Abstract: | The characteristics of tungsten metallization and alumina high temperature co-firing technology are explained,the influence of process parameters during sintering process (temperature curve and drew point) on bonding strength, hermetic properties, shrinkage was analyzed. Through repeating test and sintering theory is analyses, the best control parameters are given. |
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| Keywords: | High temperature co-firing Tungsten metallization Drew point |
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