| Influences of the Exhaust Flow on the Boundary Layer Flow on the Wafer Surface in Spin Coating System |
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| 引用本文： | Seiichi KIMURA,Mizue MUNEKATA,Hiroaki KURISHIMA,Kazuyoshi MATSUZAKI,Hideki OHBA. Influences of the Exhaust Flow on the Boundary Layer Flow on the Wafer Surface in Spin Coating System[J]. 热科学学报(英文版), 2005, 14(2): 130-135. DOI: 10.1007/s11630-005-0023-1 |
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| 作者姓名： | Seiichi KIMURA Mizue MUNEKATA Hiroaki KURISHIMA Kazuyoshi MATSUZAKI Hideki OHBA |
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| 作者单位： | Graduate School of Science and Technology Kumamoto University，Mechanical Engineering and Materials Science Kumamoto University，Tokyo Electron Kyushu LTD，Tokyo Electron AT LTD，Mechanical Engineering and Materials Science Kumamoto University |
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| 摘 要： | Recently, development of high technology has been required for the formation of thin uniform film in manufacturing processes of semiconductor as the semiconductor become more sophisticated. Spin coating is usually used for spreading photoresist on a wafer surface. However, since rotating speed of the disk is very high in spin coating, the dropped resist scatters outward and reattaches to the film surface. So, the scattered resist is removed by the exhaust flow generated at the gap between the wafer edge and the catch cup. It is seriously concerned that the stripes called Ekman spiral vortices appears on the disk in the case of high rotating speed and the film thickness increases near the wafer edge in the case of low rotating speed, because it prevent the formation of uniform film. The purpose of this study is to make clear the generation mechanism of Ekman spiral vortices and the influence of exhaust flow on it Moreover the influence of the catch cup geometry on the wafer surface boundary layer flow is investigated.
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| 关 键 词： | 立式圆盘流 自旋电镀 边界层流 热-线测量 |
| 收稿时间： | 2005-04-29 |
Influences of the exhaust flow on the boundary layer flow on the wafer surface in spin coating system |
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| Seiichi Kimura,Mizue Munekata,Hiroaki Kurishima,Kazuyoshi Matsuzaki,Hideki Ohba. Influences of the exhaust flow on the boundary layer flow on the wafer surface in spin coating system[J]. Journal of Thermal Science, 2005, 14(2): 130-135. DOI: 10.1007/s11630-005-0023-1 |
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| Authors: | Seiichi Kimura Mizue Munekata Hiroaki Kurishima Kazuyoshi Matsuzaki Hideki Ohba |
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| Affiliation: | (1) Graduate School of Science and Technology, Kumamoto University, Japan;(2) Mechanical Engineering and Materials Science, Kumamoto University, Japan;(3) Tokyo Electron Kyushu LTD, Japan;(4) Tokyo Electron AT LTD, Japan |
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| Abstract: | Recently, development of high technology has been required for the formation of thin uniform film in manufacturing processes of semiconductor as the semiconductor become more sophisticated. Spin coating is usually used for spreading photoresist on a wafer surface. However, since rotating speed of the disk is very high in spin coating, the dropped resist scatters outward and reattaches to the film surface. So, the scattered resist is removed by the exhaust flow generated at the gap between the wafer edge and the catch cup. It is seriously concerned that the stripes called Ekman spiral vortices appears on the disk in the case of high rotating speed and the film thickness increases near the wafer edge in the case of low rotating speed, because it prevent the formation of uniform film. The purpose of this study is to make clear the generation mechanism of Ekman spiral vortices and the influence of exhaust flow on it Moreover the influence of the catch cup geometry on the wafer surface boundary layer flow is investigated. |
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| Keywords: | rotating disk flow spin coating boundary layer flow hot-wire measurement |
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