基于微波热裂法的陶瓷切割技术

针对传统陶瓷切割方法普遍存在的高污染、高噪声、低切割面质量等缺点，提出了一种基于微波热裂法的陶瓷切割方法。阐述了微波热裂法的切割原理, 开发了实验装置，该装置所形成的微波能束为有效加热区域直径约6 mm的圆形热源。通过实验研究了利用该热源切割四种陶瓷（玻璃、碳化硅板、氧化铝板和氧化锆板）的机理。研究结果表明：吸波陶瓷内部的微缺陷处有爆破点产生，这有利于降低陶瓷材料切割所需宏观温度（玻璃：85 ℃，碳化硅：230 ℃）；非吸波陶瓷表面涂覆的石墨层中有微放电痕迹产生，进而可获得偏移较小的切割轨迹；与激光热源相比，微波热源具有更广泛的适用性和更低成本的优点。

Technology of Cutting Ceramic Sheets with Microwave Based on Thermal Controlled Fracture Method

Traditional ceramic cutting methods had the disadvantages of high pollution, high noise and low cutting quality. A method of cutting ceramic sheets with microwave was proposed based on thermal controlled fracture method, which might overcome the obstacles stated above. The cutting principles with microwave of thermal controlled fracture method were expounded, the experimental apparatus was developed to form circular microwave heating source, which was a circular microwave beam with diameter of 6 mm. And the mechanism of cutting four kinds of ceramics (glass, SiC plate, Al2O3 plate and ZrO2 plate) was studied by experiments. The research results show that bursting points are easy to occur at the internal micro-defects of absorbing ceramics, which are beneficial to reduce the cutting temperature(glass:85 ℃, SiC:230 ℃). The micro-discharge tracks are found in the coated graphite layer of non-absorbing ceramics, which may obtain a cutting path with smaller offsets. Compared with laser heat sources, the microwave heat source has advantages of wider applicability and lower cost.