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Thermal,mechanical, and shape‐memory properties of nanorubber‐toughened,epoxy‐based shape‐memory nanocomposites
Authors:Hong‐Qiu Wei  Ye Chen  Tao Zhang  Liwu Liu  Jinliang Qiao  Yanju Liu  Jinsong Leng
Affiliation:1. Center for Composite Materials and Structures, Harbin Institute of Technology, Harbin, People's Republic of China;2. Department of Materials Science and Engineering, Harbin Institute of Technology at Weihai, Weihai, People's Republic of China;3. School of Mechanical and Automotive Engineering, Kingston University, London, United Kingdom;4. Department of Astronautical Science and Mechanics, Harbin Institute of Technology, Harbin, People's Republic of China;5. Beijing Research Institute of Chemical Industry, SINOPEC, Beijing, People's Republic of China
Abstract:Epoxy‐based shape‐memory polymers (ESMPs) are a type of the most promising engineering smart polymers. However, their inherent brittleness limits their applications. Existing modification approaches are either based on complicated chemical reactions or done at the cost of the thermal properties of the ESMPs. In this study, a simple approach was used to fabricate ESMPs with the aim of improving their overall properties by introducing crosslinked carboxylic nitrile–butadiene nanorubber (CNBNR) into the ESMP network. The results show that the toughness of the CNBNR–ESMP nanocomposites greatly improved at both room temperature and the glass‐transition temperature (Tg) over that of the pure ESMP. Meanwhile, the increase in the toughness did not negatively affect other macroscopic properties. The CNBNR–ESMP nanocomposites presented improved thermal properties with a Tg in a stable range around 100 °C, enhanced thermal stabilities, and superior shape‐memory performance in terms of the shape‐fixing ratio, shape‐recovery ratio, shape‐recovery time, and repeatability of shape‐memory cycles. The combined property improvements and the simplicity of the manufacturing process demonstrated that the CNBNR–ESMP nanocomposites are desirable candidates for large‐scale applications in the engineering field as smart structural materials. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 45780.
Keywords:mechanical properties  stimuli‐sensitive polymers  thermal properties
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