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MXene fillers and silver flakes filled epoxy resin for new hybrid conductive adhesives

Affiliation:	1. School of Mechanical Engineering, Xinjiang University, Wulumuqi, 830000, China;2. Key Laboratory of Automobile Materials, School of Materials Science and Engineering, Jilin University, Changchun, 130022, China;1. Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, 518055, PR China;2. State Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing, 100084, PR China;3. Institute for Advanced Ceramics, School of Materials Science and Engineering, Harbin Institute of Technology, Harbin, 150001, PR China;1. Fiber Optics & Photonics Division, CSIR-Central Glass & Ceramic Research Institute, 196, Raja S.C. Mallick Rd, Kolkata, 700032, West Bengal, India;2. Specialty Glass Division, CSIR-Central Glass & Ceramic Research Institute, 196, Raja S.C. Mallick Rd, Kolkata, 700032, West Bengal, India;3. Refractories and Traditional Ceramics Division, CSIR-Central Glass & Ceramic Research Institute, 196, Raja S.C. Mallick Rd, Kolkata, 700032, West Bengal, India;4. Department of Chemistry, Jadavpur University, 188 Raja S.C. Mallick Rd, Kolkata, 700032, West Bengal, India;5. Academy of Scientific and Innovative Research (AcSIR), Ghaziabad, 201002, India;6. Department of Electrical Engineering, Indian Institute of Technology Bombay, Powai, Mumbai, 400076, India;1. School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, 510006, China;2. School of Mechanical Engineering, Hunan University of Technology, Zhuzhou, 412007, China;3. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, 72 Wenhua Road, Shenyang, 110016, China;4. Aluminum Valley Industrial Technology Institute, 888 Aluminum Valley Building, Heban 2nd Road, Zouping, 256200, China;1. College of Science, Ningbo University of Technology, Ningbo, 315211, PR China;2. Institute of Micro/Nano Materials and Devices, Ningbo University of Technology, Ningbo, 315211, PR China;3. Zhejiang Fuyan New Material Co.,Ltd, Zhejiang Province, 317199, PR China;1. National Key Laboratory of Science and Technology on High-strength Structural Materials, Central South University, Changsha, 410083, PR China;2. Advanced Technology & Materials Co. Ltd, Beijing, 100081, PR China

Abstract:	The addition of V₂CT_x two-dimensional materials as auxiliary fillers in conductive adhesives can increase the contact area between conductive particles inside the matrix effectively reducing the resistivity of epoxy resin conductive adhesives. The V₂CT_x/Ag/rGO/MWCNTs fillers inside the epoxy resin will connect more Ag-clad Cu particles to form a conductive pathway, but its excessive content will be aggregated inside and thus increase the resistivity of the conductive adhesive. The volume resistivity of ECAs increases from 4.4 × 10⁻⁶ Ω m to 1.15 × 10⁻⁵ Ω m when the V₂CT_x/Ag/rGO/MWCNTs content of 0.1% increases to 0.34%. The Ag-clad Cu particles are interconnected inside the epoxy resin to form an electron transfer network. Inside the epoxy resin substrate Ag-clad Cu particles and V₂CT_x/Ag/rGO/MWCNTs interconnects to form a larger conductive network, so that the conductive adhesive shows good conductive properties.

Keywords:	MXene Silver-coated copper Electrical conductive adhesives ECAs
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