Enhanced thermal performance of hybrid interface materials supported by 3D thermally conductive SiC framework |
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| Affiliation: | 1. School of Low-carbon Energy and Power Engineering, China University of Mining and Technology, Xuzhou, 221116, China;2. Xuzhou College of Industrial Technology, Xuzhou, 221140, China;3. School of Energy and Environmental Engineering, Hebei University of Technology, Tianjin, 300401, China;1. Department of Science and Humanities, Sri Krishna College of Engineering and Technology, Coimbatore, 641008, Tamilnadu, India;2. Department of Physics, KPR Institute of Engineering and Technology, Coimbatore, 641407, Tamilnadu, India;3. Physics Department, Faculty of Science, King Khalid University, P.O. Box 9004, Abha, 61413, Saudi Arabia;1. State Key Laboratory of New Textile Materials and Advanced Processing Technologies, Wuhan Textile University, Wuhan, Hubei, 430200, China;2. School of Textile Science and Engineering, Wuhan Textile University, Wuhan, Hubei, 430200, China;1. Southern Federal University, Research Institute of Physics, Rostov-on-Don, Russia;2. Kh. Ibragimov Complex Institute of the Russian Academy of Sciences (CI RAS), Grozny, Russia;3. Southern Federal University, Faculty of Physics, Rostov-on-Don, Russia;4. Southern Federal University, Institute of Nanotechnologies, Electronics and Equipment Engineering, Taganrog, Russian Federation;5. Southern Federal University, Institute of High Technology and Piezo Technic, Rostov-on-Don, Russia;6. Chechen State University A.A. Kadyrov, Institute of Mathematics, Physics and Information Technology, Grozny, Russia;7. Chechen State University, Department of Applied Physics, Grozny, Russia;1. School of Materials Science and Engineering, South China University of Technology, Guangzhou, China;2. National Engineering Research Center for Tissue Restoration and Reconstruction, South China University of Technology, Guangzhou, China;3. Key Laboratory of Biomedical Materials and Engineering of the Ministry of Education, South China University of Technology, Guangzhou, 510006, China;1. The State Key Laboratory of Refractories and Metallurgy, Wuhan University of Science and Technology, Wuhan, 430081, PR China;2. College of Materials & Metallurgy, Wuhan University of Science and Technology, Wuhan, 430081, PR China;3. Shaanxi Huaqin Technology Industry Co., Ltd., Xi’an, 710000, PR China |
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| Abstract: | The rapid development of microelectronic integration technology is placing increasing demands on the safety performance of electronic devices. Excellent thermal interface materials (TIM) facilitate the dissipation of heat from electronic components, which ensures the safety of electronic equipment. In this work, a three-dimensional (3D) thermally conductive framework is constructed from carbon fibers to form silicon carbide (SiC) in situ. This is followed by vacuum impregnation with paraffin wax (PW) to produce phase change composites (PCCs). The results show that the SiC-based 3D thermally conductive framework has a hierarchical porous network structure, and the PCC indicates enhanced thermal conductivity and good anti-leakage properties. The thermal conductivity of PW @ CF1–Si1-1550 is 0.81 W K−1m−1, which is 4 times that of PW. In addition, the PCC also shows good thermal cycling properties, high thermal storage capacity (179.06 Jg-1), and good insulation properties. The PCC as described in this paper as TIM have considerable application potential in thermal management. |
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| Keywords: | Heat transfer enhancement Phase change material Thermal management Three-dimensional framework |
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