| 导热绝缘高分子复合材料中填料的研究进展 |
| |
| 引用本文： | 吕勇,罗世永,许文才.导热绝缘高分子复合材料中填料的研究进展[J].北京印刷学院学报,2008,16(2):76-78. |
| |
| 作者姓名： | 吕勇 罗世永 许文才 |
| |
| 作者单位： | 北京印刷学院,包装材料实验室,北京,102600;北京印刷学院,包装材料实验室,北京,102600;北京印刷学院,包装材料实验室,北京,102600 |
| |
| 基金项目： | 北京市属高等学校人才学术创新团队资助项目PHR |
| |
| 摘 要： | 工业生产和科学技术发展对导热材料提出了新的更高要求,除导热性外,希望材料具有优良的综合性能。填充型导热绝缘高分子复合材料具有价格低廉、且易加工成型,经过适当的工艺处理或配方调整,可以应用于特殊领域。在对填充型导热绝缘高分子复合材料的应用研究进展综述的同时,主要探讨了填料种类,填料比例,填料颗粒大小,填料形状,填料表面特征等对导热绝缘高分子材料的导热性能影响。
|
| 关 键 词： | 导热填料 导热绝缘 复合材料 |
| 文章编号： | 1004-8626(2008)02-0076-03 |
| 修稿时间： | 2007年9月27日 |
Progress in Fillings Applied to Insulating and Thermally Conductive Polymer Composite |
| |
| LV Yong,LUO Shi-yong,XU Wen-cai.Progress in Fillings Applied to Insulating and Thermally Conductive Polymer Composite[J].Journal of Beijing Institute of Graphic Communication,2008,16(2):76-78. |
| |
| Authors: | LV Yong LUO Shi-yong XU Wen-cai |
| |
| Affiliation: | (Lab of Packaging Material and Technology, Beijing Institute of Graphic and Communication, Beijing 102600, China) |
| |
| Abstract: | With the great development on industrial manufacture and technology, new thermally conductive materials are needed meantime, excellent integrated performance should be provided with besides highly thermal conductivity. Due to the advantage of low cost and simply molding, insulating and thermally conductive polymer composite can be used in especial field through appropriate processing or desirable. Fillings applied to insulating thermal conductive polymer composite are reviewed. The types of the fillings, the proportion in the composition, the diameter, the shape of the filling and the characteristic of the surface are also mainly discussed. |
| |
| Keywords: | thermal conducting filler thermally conductive ＆ insulating polymer composite |
| 本文献已被 维普 万方数据 等数据库收录！ |
|
