| 激光重熔在钎料凸点成形中的应用 |
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| 引用本文： | 田艳红,王春青. 激光重熔在钎料凸点成形中的应用[J]. 电子工艺技术, 2002, 23(4): 139-142 |
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| 作者姓名： | 田艳红 王春青 |
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| 作者单位： | 哈尔滨工业大学现代焊接生产技术国家重点实验室,黑龙江,哈尔滨,150001 |
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| 摘 要： | 激光由于具有高能量输入密度以及可局部加热的优点而在面阵列电子封装钎料凸点成形中具有潜在的优势，介绍了激光重熔在面阵列封装钎料凸点成形中的研究进展，并且对PBGA共晶钎料球激光重熔进行了工艺研究，研究结果表明；采用合适的激光输入能量可以在非常短的时间内获得表面质量光滑的钎料凸点。
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| 关 键 词： | 面阵列封装 激光重熔 钎料凸点 |
| 文章编号： | 1001-3474(2002)04-0139-04 |
| 修稿时间： | 2002-02-12 |
Research Status and Application of Laser Reflow on Solder Bump Forming of Area Array Packages |
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| TIAN Yan-hong,WANG Chun-qing. Research Status and Application of Laser Reflow on Solder Bump Forming of Area Array Packages[J]. Electronics Process Technology, 2002, 23(4): 139-142 |
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| Authors: | TIAN Yan-hong WANG Chun-qing |
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| Abstract: | Laser reflow bumping becomes a potential technique due to the unique characteristic of laser such as high energy input density and local heating.Research status of laser reflow on solder bump forming of area array packages are introduced,and experimental analysis on laser reflow of PBGA solder ball is performed.Results show that good quality of solder bump with smooth surface and high shear strength can be achieved under appropriate laser input energy. |
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| Keywords: | Area array packages Laser reflow Solder bump |
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