| 双面贴装电路板上BGA焊点的潜在失效机理 |
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| 引用本文： | 陆裕东,何小琦,恩云飞,王歆,庄志强. 双面贴装电路板上BGA焊点的潜在失效机理[J]. 半导体技术, 2008, 33(11) |
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| 作者姓名： | 陆裕东 何小琦 恩云飞 王歆 庄志强 |
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| 作者单位： | 信息产业部,电子第五研究所,电子元器件可靠性物理及其应用技术国家级重点实验室,广州,510610;华南理工大学,材料学院,特种功能材料教育部重点实验室,广州,510640;信息产业部,电子第五研究所,电子元器件可靠性物理及其应用技术国家级重点实验室,广州,510610;华南理工大学,材料学院,特种功能材料教育部重点实验室,广州,510640 |
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| 基金项目： | 国家部委科研项目，信息产业部电子第五研究所科技发展基金 |
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| 摘 要： | 采用双面贴装回流焊工艺在FR4基板表面贴装Sn3.0Ag0.5Cu(SnAgCn)无铅焊点BGA器件,通过对热应力加速实验中失效的SnAgCu无铅BGA焊点的显微结构分析和力学性能检测,研究双面贴装BGA器件的电路板出现互连焊点单面失效问题的原因,单面互连焊点失效主要是由于回流焊热处理工艺引起的.多次热处理过程中,NiSnP层中形成的大量空洞是导致焊点沿(Cu,Ni)6Sn5金属间化合物层和Ni(P)镀层产生断裂失效的主要因素.改变回流焊工艺是抑制双面贴装BGA器件的印制电路板出现互连焊点单面失效问题的关键.
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| 关 键 词： | 锡银铜 无铅 焊点 球栅阵列 失效 |
Potential Failure Mechanism of BGA Solder on Double-Sided Board |
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| Lu Yudong,He Xiaoqi,En Yunfei,Wang Xin,Zhuang Zhiqiang. Potential Failure Mechanism of BGA Solder on Double-Sided Board[J]. Semiconductor Technology, 2008, 33(11) |
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| Authors: | Lu Yudong He Xiaoqi En Yunfei Wang Xin Zhuang Zhiqiang |
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| Affiliation: | Lu Yudong1,2,He Xiaoqi1,En Yunfei1,Wang Xin2,Zhuang Zhiqiang2(1.National Key Laboratory for Reliability Physics , Its Application Technology of Electrical Component,the 5thElectronics Research Institute of the Ministry of Information Industry,Guangzhou 510610,China,2.Key Laboratory of Specially Functional Materials,Ministry of Education,College of Materials Science , Engineering,South China University of Technology,Guangzhou 510640,China) |
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| Abstract: | BGA Ball-Grid-Array packages with Sn3.0Ag0.5Cu lead-free solder were assembled on FR4 substrate by reflow soldering technology.The microstructure and mechanical properties of lead-free Sn3.0Ag0.5Cu BGA solder were studied,which were failure after thermal stress tests.And the failure mechanism of specifically side solder on double-side board was discussed.The reflow soldering technology results in the failure of specifically side solder.The voids produced during annealing process in the NiSnP layer caused th... |
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| Keywords: | SnAgCu lead-free solder BGA failure |
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