| 铜及其合金的化学抛光工艺研究 |
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| 引用本文： | 张婕,梁成浩,王鹏,郭承忠. 铜及其合金的化学抛光工艺研究[J]. 表面技术, 2006, 35(6): 43-45 |
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| 作者姓名： | 张婕 梁成浩 王鹏 郭承忠 |
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| 作者单位： | 大连理工大学化工学院,辽宁,大连,116012;大连理工大学化工学院,辽宁,大连,116012;大连海事大学机电与材料工程学院,辽宁,大连,116026 |
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| 摘 要： | 对铜及其合金的化学抛光工艺及配方进行研究,通过正交试验得到了一组较好的铜及其合金化学抛光工艺配方.在此基础上讨论了抛光液各组分浓度、抛光温度以及抛光次数对抛光效果的影响.结果表明,经化学抛光后的铜及其合金表面光亮,达到镜面效果.抛光液维护方便、操作安全、无有害气体逸出,是一种理想的铜及其合金表面化学抛光工艺.
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| 关 键 词： | 化学抛光 H2O2-H2SO4体系 铜 铜合金 |
| 文章编号： | 1001-3660（2006）06-0043-03 |
| 收稿时间： | 2006-08-29 |
| 修稿时间： | 2006-08-29 |
Research on Chemical Polishing of Copper and its Alloy |
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| ZHANG Jie,LIANG Cheng-hao,WANG Peng,GUO Cheng-zhong. Research on Chemical Polishing of Copper and its Alloy[J]. Surface Technology, 2006, 35(6): 43-45 |
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| Authors: | ZHANG Jie LIANG Cheng-hao WANG Peng GUO Cheng-zhong |
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| Abstract: | The technology of copper and its alloy is studied. Based on the orthogonal experiment, the effect of some control factors, such as concentration of individual component, temperature and operation-times on the quality of polished copper and its alloy are discussed. The result concludes that the polishing solution is innocuous and harmless to the environment. The effort of chemical polishing is terrific. |
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| Keywords: | Chemical polishing H2O2-H2SO4 system Copper Copper alloy |
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