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Fabrication of NbN/AlN/NbN junctions with Al embedding circuits on Si membrane for 1.5 THz SIS mixers
Affiliation:2. CEA-Grenoble. DRFMC/SPSMS, 17 rue des Martyrs, 38054 Grenoble Cedex-9, France;3. DEMIRM-Observatoire de Paris, 61 avenue de l''Observatoire, 75014 Paris, France
Abstract:A process has been developed to fabricate NbN tunnel junctions and 1.5 THz SIS mixers with Al electrodes and Al/SiO2/Al microstrip tuning circuits on thin Si membranes patterned on silicon on insulator wafers (SIMOX). High Josephson current density (Jc up to 2×104 A/cm2) NbN/AlN/NbN and NbN/MgO/NbN SIS junctions have been fabricated with a reasonably good Vm quality factor and energy gap values close to 5 meV at 4.2 K on (100) oriented 3 inches SIMOX wafers covered by a thin (∼8 nm) MgO buffer layer. The sputtering conditions critically influence the dielectric quality of both AlN and MgO tunnel barriers as well as the surface losses of NbN electrodes. 0.6-μm Si/SiO2 membranes are obtained after processing of a whole wafer and etching the individual chips in EDP. Such a technology is applied to the development of a waveguide/membrane SIS mixer for use around 1.5 THz.
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