| 脉冲镍磷复合电镀工艺的研究 |
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| 引用本文： | 曹铁华,成旦红,桑付明,袁蓉,徐伟一.脉冲镍磷复合电镀工艺的研究[J].电镀与涂饰,2004,23(2):13-15. |
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| 作者姓名： | 曹铁华 成旦红 桑付明 袁蓉 徐伟一 |
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| 作者单位： | 上海大学环境与化工学院,上海,200072;上海大学理学院,上海,200072;上海大学环境与化工学院,上海,200072;上海大学理学院,上海,200072;上海大学环境与化工学院,上海,200072;上海大学理学院,上海,200072;上海大学环境与化工学院,上海,200072;上海大学理学院,上海,200072;上海大学环境与化工学院,上海,200072;上海大学理学院,上海,200072 |
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| 摘 要： | 通过正交试验，确定了脉冲Ni—P—SiO2纳米复合电镀的最佳工艺。讨论了工艺条件对镀层沉积速率的影响。扫描电镜照片表明，采用脉冲电镀比采用直流电镀获得的Ni—P—SiO2纳米复合镀层的微观形貌更好。
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| 关 键 词： | 脉冲电镀 Ni-P-SiO2纳米复合 微观形貌 |
| 文章编号： | 1004-227X(2004)02-0013-03 |
Study on process of Ni-P-SiO2 nano-composite pulse plating |
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| CAO Tie-hua,CHENG Dan-hong,SANG Fu-ming,YUAN Rong,XU Wei-yi.Study on process of Ni-P-SiO2 nano-composite pulse plating[J].Electroplating & Finishing,2004,23(2):13-15. |
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| Authors: | CAO Tie-hua CHENG Dan-hong SANG Fu-ming YUAN Rong XU Wei-yi |
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| Abstract: | Process of Ni-P-SiO_2 nano-composite pulse plating was optimized by orthogonal test. Effects of process conditions on deposition rate and micro-hardness of composite deposit were discussed. SEM pictures show that Ni-P-SiO_2 nano-composite deposit obtained with pulse current has better morphological structure than that obtained with direct current. |
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| Keywords: | pulse plating Ni-P-SiO_2 nano-composite morphological structure |
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