| 低温低膨胀系数高硬度无铅电子玻璃粉 |
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| 引用本文： | 肖永强,李宏杰,卫海民,蒋文军,张志旭.低温低膨胀系数高硬度无铅电子玻璃粉[J].玻璃与搪瓷,2012,40(4):1-5. |
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| 作者姓名： | 肖永强 李宏杰 卫海民 蒋文军 张志旭 |
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| 作者单位： | 1. 中船重工第705研究所高技术公司,陕西西安,710065
2. 西安创联宏晟电子有限公司,陕西西安,710065 |
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| 摘 要： | 叙述了低温低膨胀系数无铅电子玻璃粉研制过程。当Bi2O3的质量分数在60%,B2O3在10.7%,ZnO在21.3%,SiO2在5%,其它成分在3%时,可获得膨胀系数为(55～62)×10-7/℃,软化点为380～385℃,玻化温度在450±10℃,附着力优良的无铅玻璃粉。
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| 关 键 词： | 无铅玻璃粉 低温烧结 低膨胀系数 |
Lead- Free Electronic Glass Powder with Properties of Lower Sintering Temperature and Lower Expansion Coefficient and Higher Hardness |
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| XIAO Yong-qiang
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LI Hong-jie
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WEI Hai-min
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JIANG Wen-jun
,
ZHANG Zhi-xu.Lead- Free Electronic Glass Powder with Properties of Lower Sintering Temperature and Lower Expansion Coefficient and Higher Hardness[J].Glass & Enamel,2012,40(4):1-5. |
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| Authors: | XIAO Yong-qiang LI Hong-jie WEI Hai-min JIANG Wen-jun ZHANG Zhi-xu |
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| Affiliation: | 1.CSIC-The 705th Research Institute Hi-Technology Co.,Ltd,Xian 710065,China;2.Xian Chuanglian Hongsheng Electronic Co.,Ltd,Xian 710065,China) |
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| Abstract: | The Lead-free electronic glass powder with properties of lower sintering temperature,lower expansion coefficient and higher hardness was briefly introduced.The results show that this glass powder can be obtained when it contains 60% Bi2O3,10.7% B2O3,21.3% ZnO,5% SiO2 and 5% other oxides.The glass made from this powder has the properties of thermal expansion coefficient within the range of（55-62）×10-7/℃,softening point within 380~385℃,sintering temperature about 450±10℃ and also has high adhesive strength. |
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| Keywords: | lead-free glass powders lower temperature sintering lower thermal expansion coefficient |
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