| Cu对Sn-9Zn无铅钎料电化学腐蚀性能的影响 |
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| 引用本文： | 樊志罡,马海涛,王来. Cu对Sn-9Zn无铅钎料电化学腐蚀性能的影响[J]. 中国有色金属学报, 2007, 17(8): 1302-1306 |
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| 作者姓名： | 樊志罡 马海涛 王来 |
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| 作者单位： | 大连理工大学,材料科学与工程学院,大连,116024 |
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| 摘 要： | 对Sn-9Zn-xCu钎料在3.5%NaCl溶液中的电化学腐蚀行为进行研究,以揭示添加Cu对Sn-9Zn钎料耐蚀性的影响。结果表明:添加Cu元素使Sn-Zn钎料的腐蚀电位有所增加,即添加Cu元素可以改善Sn-Zn钎料的耐腐蚀性能;XRD检测发现Sn-9Zn-xCu钎料的腐蚀产物中存在Zn5(OH)8Cl2.H2O;随着Cu含量的增加,Zn5(OH)8Cl2.H2O的量逐渐减少,出现Cu的腐蚀产物,腐蚀表面趋于均匀平整,选择性腐蚀减弱,腐蚀产物的黏附性较好。
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| 关 键 词： | 无铅钎料 Sn-Zn-Cu钎料 NaCl溶液 电化学腐蚀 |
| 文章编号： | 1004-0609（2007）08-1302-05 |
| 收稿时间： | 2007-01-02 |
| 修稿时间： | 2007-01-022007-03-29 |
Effect of Cu on electrochemical corrosion behavior of lead-free Sn-9Zn-xCu solder |
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| FAN Zhi-gang,MA Hai-tao,WANG Lai. Effect of Cu on electrochemical corrosion behavior of lead-free Sn-9Zn-xCu solder[J]. The Chinese Journal of Nonferrous Metals, 2007, 17(8): 1302-1306 |
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| Authors: | FAN Zhi-gang MA Hai-tao WANG Lai |
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| Abstract: | The electrochemical corrosion behavior of lead-free Sn-9Zn-xCu(x=0?6) solder in 3.5% NaCl solution was studied,in order to reveal the effect of Cu on the corrosion resistance of Sn-9Zn solder.The results indicate that the corrosion potential increases with increasing the addition of Cu,so Cu can improve the corrosion resistance of Sn-Zn solders.XRD results indicate that Zn5(OH)8Cl2.H2O exists in the corrosion products of Sn-9Zn-xCu.With increasing Cu content,the quantity of Zn5(OH)8Cl2.H2O decreases,the corrosion products containing Cu form,the surface tends to be smooth,and the selective oxidation weakens. |
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| Keywords: | free-lead solder Sn-Zn-Cu solder NaCl solution electrochemical corrosion |
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