气动加热对空空导弹内部电路的温度影响分析

空空导弹弹体尾部组件所处位置特殊,工作环境严酷,本文基于Flo THERM建立该组件的热仿真模型并进行计算分析,以明确气动加热对弹体内部电路的温度影响程度,为保证元器件留有足够的温升余量提供数据支撑。结果表明,受试产品内部电路的温升相对滞后,而壳体温度峰值时间为内部电路温升迅速变化的分界点,且随自主飞时间的延长温升越为显著。

Analysis for Temperature Effect of Aerodynamic Heating on the Internal Circuit of the Air-to-Air Missile

The air-to-air missile subassembly located in special position, cause the harsh operational environment.The temperature effect of the aerodynamic heating to the internal circuit is indicated by this subassembly thermal simulation calculation analysis based on FloTHERM, and the proof for the temperature rise control of the component is carried out.The simulation results show that the temperature rise of the subassembly internal circuit is delayed, and the peak time of shell temperature is the demarcation point where the internal circuit temperature rise changed rapidly, and also more remarkable while the self-flying time is longer.