水洗钎剂下SnAgCuRExNi与铜引线的润湿适配性

采用润湿平衡法,选用商用水洗钎剂,研究了镍添加量及钎焊工艺参数对Sn2.5Ag0.7Cu0.1RE钎料合金在铜引线上的润湿适配性. 结果表明,当Sn2.5Ag0.7Cu0.1RE钎料合金中镍添加量为0.05%时,钎料合金显微组织明显细化;当钎焊温度为255 ℃、钎焊时间为5 s、浸渍速度为20 mm/s、浸渍深度为3 mm的情况下, 其与φ0.6×30 mm的铜引线具有较好的润湿适配性,即具有较短的润湿时间,较小的润湿角,较大的润湿力,符合润湿力、润湿时间和润湿角的相关标准，完全满足现代表面组装技术对无铅钎料润湿性能的要求.

Wetting match properties of Sn2.5Ag0.7Cu0.1RExNi solder alloy on surface of copper wire with water soluble flux

The wetting match properties of Sn2.5Ag0.7Cu0.1RE lead-free solder on the surface of copper wire with tiny Ni addition and different soldering parameters by adopting commercial water-soluble flux were investigated by means of wetting balance methods. The obtained results show that the microstructure of Sn2.5Ag0.7Cu0.1RExNi solder alloy can be refined with the addition of 0.05 % Ni; and it has better wetting match proprieties on the surface of 0.6×30 mm copper wire at soldering temperature of 255 ℃, soldering time of 5 s, impregnating speed of 20 mm/s and the impregnating depth of 3 mm, i.e. it has higher wetting force, smaller wetting angle and shorter wetting time. The wetting properties can fully accord with the standards of the wetting force, wetting time and wetting angle, and meet the standard to the lead-free solders of surface mount technology industry.