| 印制板化学镀Pd／Au镀层工艺 |
| |
| 引用本文： | 王丽丽.印制板化学镀Pd／Au镀层工艺[J].电镀与精饰,1995,17(2):38-40. |
| |
| 作者姓名： | 王丽丽 |
| |
| 作者单位： | 南京市太平桥南8-503 210018 |
| |
| 摘 要： | 概述了印制板化学镀Ｐｄ／Ａｕ组合镀层工艺：（１）印制板化学镀Ｐｄ以后活化Ｐｄ表面；（２）在活化过的Ｐｄ表面上化学镀Ａｕ。
|
| 关 键 词： | 印制板 化学镀 镀层 合金 印刷电路 |
Electroless Plating Process of Pd/Au Combination Coating For Printed Circuit Boards |
| |
| Wang Lili.Electroless Plating Process of Pd/Au Combination Coating For Printed Circuit Boards[J].Plating & Finishing,1995,17(2):38-40. |
| |
| Authors: | Wang Lili |
| |
| Abstract: | This paper describes an electro less plating process for making palladium/gold combination
coating. The process includes: (1) activating a palladium substrate after electroless palladium
plating on the printed circuit boards; (2) then electrolessly depositing gold onto an activated
palladium substrate. |
| |
| Keywords: | printed circuit board electroless plating Pd / Au combination coating |
| 本文献已被 CNKI 维普 等数据库收录！ |
