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金属结合剂金刚石砂轮表面微槽的激光修整技术
引用本文:郭泫洋,徐钰淳,曹剑锋,朱建辉,赵延军,赵金伟,师超钰.金属结合剂金刚石砂轮表面微槽的激光修整技术[J].金刚石与磨料磨具工程,2022,42(3):364-372.
作者姓名:郭泫洋  徐钰淳  曹剑锋  朱建辉  赵延军  赵金伟  师超钰
作者单位:1.超硬材料磨具国家重点实验室, 郑州 4500012.郑州磨料磨具磨削研究所有限公司, 郑州 450001
摘    要:针对金属结合剂金刚石砂轮表面微槽修整困难的问题,采用红外纳秒激光器开展修整试验,探究激光功率、脉冲重复频率、激光烧蚀时间等因素对其材料去除的影响规律,并对U型和V型2种砂轮微槽提出梯度步进激光修整工艺。结果表明:修整后的砂轮微槽实际轮廓与设计轮廓对比,其顶部和底部实际宽度相对误差的绝对值最大为4.4%,实际深度相对误差的绝对值最大为9.6%。用修整后的砂轮V型微槽对直径为4英寸(10.16 cm)的蓝宝石晶圆边缘进行倒角,晶圆锐利的边缘被修整成规则形状,边缘轮廓对称度良好,且与激光修整后砂轮表面的微槽轮廓一致,验证了金属结合剂金刚石砂轮表面微槽激光成型修整的可行性。 

关 键 词:激光加工    金属结合剂金刚石砂轮    微槽修整    晶圆边缘磨削
收稿时间:2021-04-06

Laser dressing technology for micro-grooves on the surface of metal-bonded diamond wheels
GUO Xuanyang,XU Yuchun,CAO Jianfeng,ZHU Jianhui,ZHAO Yanjun,ZHAO Jinwei,SHI Chaoyu.Laser dressing technology for micro-grooves on the surface of metal-bonded diamond wheels[J].Diamond & Abrasives Engineering,2022,42(3):364-372.
Authors:GUO Xuanyang  XU Yuchun  CAO Jianfeng  ZHU Jianhui  ZHAO Yanjun  ZHAO Jinwei  SHI Chaoyu
Affiliation:1.State Key Laboratory of Superabrasives, Zhengzhou 450001, China2.Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd., Zhengzhou 450001, China
Abstract:In order to solve the difficult problem of dressing micro-grooves on the surface of metal-bonded diamond wheel, an infrared nanosecond laser was used to carry out the dressing test. The influences of laser average power, pulse repetition frequency, laser ablation time and other factors on the material removal of metal-bonded diamond grinding wheel was investigated. A gradient step laser dressing process was proposed for U-shaped and V-shaped grinding wheel micro-grooves. The results show that the actual contour of the grinding wheel micro-groove after dressing is compared with the designed contour, the maximum absolute value of the relative error of the actual width at the top and bottom is 4.4%, and the maximum absolute value of the relative error of the actual depth is 9.6%. The edge of the sapphire wafer with a diameter of 4 inches (10.16 cm) is chamfered with the V-shaped micro-groove of the trimmed grinding wheel. The sharp edge of the wafer is trimmed into a regular shape, and the symmetry of the edge contour is good, which is consistent with the micro-groove contour of the surface of the laser trimmed grinding wheel. The feasibility of laser shaping and dressing of the micro-groove on the surface of metal-bonded diamond grinding wheel is verified. 
Keywords:
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