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基于空心氧化铝微球造孔的陶瓷结合剂金刚石砂轮
引用本文:轩闯,王超超,白福厚,张凤林.基于空心氧化铝微球造孔的陶瓷结合剂金刚石砂轮[J].金刚石与磨料磨具工程,2022,42(4):442-448.
作者姓名:轩闯  王超超  白福厚  张凤林
作者单位:广东工业大学 机电工程学院,广州 510006
基金项目:广东省“珠江人才计划”本土创新科研团队项目(2017BT01C169);佛山市核心技术攻关项目(1920001000361)。
摘    要:研究空心氧化铝微球质量分数和粒径(0.2, 0.4, 0.6 mm)对砂轮的总气孔率、抗弯强度、硬度和微观结构的影响,制备以空心氧化铝微球为造孔剂的陶瓷结合剂金刚石砂轮,并研究砂轮对石英玻璃的磨削性能。结果表明:随着空心氧化铝微球质量分数增加,砂轮总气孔率升高,抗弯强度和硬度降低;空心氧化铝微球质量分数相同时,其粒径越小,砂轮的总气孔率越高,抗弯强度和硬度越低;制备的空心氧化铝微球陶瓷结合剂金刚石砂轮可用于磨削石英玻璃,加工后石英玻璃的表面粗糙度从0.5113 μm降至0.0206 μm。 

关 键 词:空心氧化铝微球    陶瓷结合剂    金刚石砂轮    总气孔率    力学性能    磨削性能
收稿时间:2022-01-16

Vitrified bond diamond grinding wheel based on hollow corundum microspheres
XUAN Chuang,WANG Chaochao,BAI Fuhou,ZHANG Fenglin.Vitrified bond diamond grinding wheel based on hollow corundum microspheres[J].Diamond & Abrasives Engineering,2022,42(4):442-448.
Authors:XUAN Chuang  WANG Chaochao  BAI Fuhou  ZHANG Fenglin
Affiliation:School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China
Abstract:The effect of the content and the size (0.2, 0.4, 0.6 mm) of the hollow corundum microspheres on the total porosity, the flexural strength, the hardness and the microstructure of vitrified bond was investigated. The ceramic bonded diamond grinding wheel with hollow alumina microspheres as pore forming agent was prepared, and the grinding performance of the grinding wheel on quartz glass was studied. The results show that with the increase of the content of hollow corundum microspheres, the porosity increases, and the flexural strength and the hardness decreases at the same time. With the same content of hollow corundum microspheres, addition the smaller size of microspheres could lead to the increase of the porosity and the decrease of flexural and hardness. The vitrified bond diamond wheel contained with hollow corundum microspheres can used to grind quartz glass, and the surface roughness can be reduced from 0.5113 μm to 0.0206 μm. Diamond wheel contained with hollow corundum microspheres can used to grind quartz glass, and the surface roughness can be reduced from 0.5113 μm to 0.0206 μm. 
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