熔炼工艺和增强相含量对Sn基复合钎料显微组织的影响

分别研究了不同冷却速率和增强相添加量对内生法制备的Cu6Sn5颗粒增强型复合钎料以及Ni颗粒增强复合钎料显微组织的影响,并得出最佳的冷却工艺条件。结果表明:空冷条件(冷却速率为2℃/s)下制备的Cu6Sn5颗粒增强型复合钎料拥有最佳的显微组织形貌特征,其金属间化合物(IMC)尺寸最小,分布最均匀。对于外加法制备的Ni颗粒增强型复合钎料,其内部大尺寸IMC对周边三元共晶组织生长方向产生严重影响。此外,值得注意的是,当Ni质量分数为0.45%时,显微组织中出现了由IMC聚集形成的树叶和雪花形态。当Ni质量分数增加至2.0%时,由于Ni元素在钎料基体中固溶的作用,显微组织中出现了均匀分布的形状和大小不一的黑色斑点。

Effects of Metallurgy Processing and Reinforcement Particle Amount on Microstructure of Sn-Based Composite Solder

The effects of different cooling rates and reinforcement particle amount on in-situ Cu6Sn5 reinforced composite solder and Ni reinforced composite solder were investigated. The results indicate that the optimal microstructure characterizations, which hold the smallest intermetallic compound (IMC) size and uniform distribution in the solder matrix, of in-situ Cu6Sn5 reinforced composite solder can be achieved under air cooling condition (the cooling rate is 2 oC/s). From the microstructure observation of Ni reinforced composite solder, it is found that big sized IMCs have a significant effect on the growth orientation of ternary eutectic phases. Besides, snow- and leaves-shaped IMCs clusters are found in Sn3.0Ag0.5Cu-0.45Ni solder matrix. When Ni addition increases to 2.0 wt%, dark spots with different sizes and shapes appear uniformly in the solder matrix due to the solid solution effect of Ni in the solder