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| CuO添加剂对Ag／SnO2润湿性与界面特性的影响 | |
| 引用本文： | 王家真 王亚平 杨志懋 王伟 丁秉钧. CuO添加剂对Ag／SnO2润湿性与界面特性的影响[J]. 稀有金属材料与工程, 2005, 34(3): 405-408 |
| 作者姓名： | 王家真 王亚平 杨志懋 王伟 丁秉钧 |
| 作者单位： | 1. 西安交通大学,金属材料强度国家重点实验室,陕西,西安,710049;中国科学院金属研究所,辽宁,沈阳,110016 2. 中国科学院金属研究所,辽宁,沈阳,110016 3. 西安交通大学,金属材料强度国家重点实验室,陕西,西安,710049 |
| 基金项目： | 国家高技术研究发展计划(863计划)(2001从320714)和国家自然科学基金资助项目(50071043) |
| 摘 要： | 采用座滴法研究了CuO对Ag/SnO2间润湿角的影响,利用扫描电镜(SEM)和电子探针显微分析(EPMA)测试了试样界面微观形貌及过渡区成分变化.结果表明,随着CuO含量的增加,SnO2与Ag的润湿性提高,7%CuO的加入,使Ag/SnO2的润湿角从90°减小到29°.加入CuO后,液态银渗入氧化物颗粒间隙,同时发生氧化物向银区的扩散,形成牢固的润湿界面. |
| 关 键 词： | 银氧化锡 触头材料 润湿 界面 |
| 文章编号： | 1002-185X(2005)03-0405-04 |
| 修稿时间： | 2003-04-25 |
Effect of CuO Additive on the Wettability and Interface Behavior of Silver/Tin Oxide |
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| Wang Jiazhen,Wang Yaping,Yang Zhimao,Wang Wei,Ding Bingjun. Effect of CuO Additive on the Wettability and Interface Behavior of Silver/Tin Oxide[J]. Rare Metal Materials and Engineering, 2005, 34(3): 405-408 | |
| Authors: | Wang Jiazhen Wang Yaping Yang Zhimao Wang Wei Ding Bingjun |
| Abstract: | The contact angles of Ag on SnO2 with different CuO content were measured by the sessile drop method, and the morphology and composition of transition zone of the interfaces were analyzed by SEM and EPMA technique. The results show that the wettability of Ag on SnO2 is improved by increasing the CuO content. The contact angle of Ag/SnO2 decreases from 90oto 29o with 7% CuO content. When CuO dopant is added into SnO2, Ag liquid can infiltrate into MeO, and a little MeO diffuses into Ag zone. So the strong interfacial bonding is obtained. |
| Keywords: | AgSnO2 contact materials wetting interface |
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