| 水基免清洗型助焊剂研究进展 |
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| 引用本文： | 吴青青,郝志峰,余坚,李宇,刘文锋,张虎. 水基免清洗型助焊剂研究进展[J]. 焊接技术, 2011, 40(1): 3-8 |
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| 作者姓名： | 吴青青 郝志峰 余坚 李宇 刘文锋 张虎 |
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| 作者单位： | 广东工业大学,轻工化工学院,广东,广州,510006 |
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| 基金项目： | 广东省科技计划项目(2010B0108000029) |
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| 摘 要： | 随着绿色化学的发展,无铅钎料专用的水基免清洗助焊剂,在未来电子工业中具有重要的应用价值.本文比较各类型助焊剂,阐述了水基免清洗助焊剂的特点,综述了国内外科研工作者改善水基免清洗助焊剂性能的研究状况,并展望该领域未来的发展方向.
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| 关 键 词： | 水基 免清洗 助焊剂 钎焊性能 |
Research progress in the water-based no-clean flux |
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| WU Qing-qing,HAO Zhi-feng,YU Jian,LI Yu,LIU Wen-feng,ZHANG Hu. Research progress in the water-based no-clean flux[J]. Welding Technology, 2011, 40(1): 3-8 |
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| Authors: | WU Qing-qing HAO Zhi-feng YU Jian LI Yu LIU Wen-feng ZHANG Hu |
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| Affiliation: | WU Qing-qing,HAO Zhi-feng,YU Jian,LI Yu,LIU Wen-feng,ZHANG Hu(Faculty of Chemical Engineering and Light Industry,Guangdong University of Technology,Guangzhou 510006,Guangdong pro.,China) |
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| Abstract: | The water-based no-clean flux for lead-free solder will be wildly used in electronic industry,it's the inevitable trend for the green chemistry.Comparing with other types of flux,the characteristic of the water-based no-clean flux was described in the paper.The recent progress on improving the water-based no-clean flux by the domestic and international researchers was summarized,and the future development was prospected as well. |
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| Keywords: | water-based no-clean flux soldering properties |
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