High-temperature dielectric and electromagnetic interference shielding properties of SiCf/SiC composites using Ti3SiC2 as inert filler |
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| Affiliation: | 1. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an, Shaanxi 710072, China;2. College of Materials and Mineral Resources, Xi’an University of Architecture and Technology, Xi’an, Shaanxi 710055, China;1. Xi’an Polytechnic University, Xi’an 710048, China;2. Northwestern Polytechnical University, Xi’an 710072, China;1. Department of Materials Engineering, Imam Khomeini International University, Qazvin, Iran;2. Faculty of Materials and Manufacturing Engineering, Malek Ashtar University of Technology, Tehran, Iran;1. Eskisehir Osmangazi University, Faculty of Engineering&Architecture, Department of Metallurgical & Materials Engineering, Meselik Campus, TR-26480, Eskisehir, Turkey;2. Eskisehir Technical University, Faculty of Engineering, Department of Materials Science & Engineering, Iki Eylul Campus, Eskisehir, Turkey |
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| Abstract: | Ti3SiC2 filler has been introduced into SiCf/SiC composites by precursor infiltration and pyrolysis (PIP) process to optimize the dielectric properties for electromagnetic interference (EMI) shielding applications in the temperatures of 25–600 °C at 8.2–12.4 GHz. Results indicate that the flexural strength of SiCf/SiC composites is improved from 217 MPa to 295 MPa after incorporating the filler. Both the complex permittivity and tan δ of the composites show obvious temperature-dependent behavior and increase with the increasing temperatures. The absorption, reflection and total shielding effectiveness of the composites with Ti3SiC2 filler are enhanced from 13 dB, 7 dB and 20 dB to 24 dB, 21 dB and 45 dB respectively with the temperatures increase from 25 °C to 600 °C. The mechanisms for the corresponding enhancements are also proposed. The superior absorption shielding effectiveness is the dominant EMI shielding mechanism. The optimized EMI shielding properties suggest their potentials for the future shielding applications at temperatures from 25 °C to 600 °C. |
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| Keywords: | A Ceramic-matrix composites (CMCs) A Particle-reinforcement B Electrical properties B High-temperature properties |
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