High field-effect-mobility a-Si:H TFT based on high deposition-ratePECVD materials |
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Authors: | Chun-Ying Chen Kanicki J. |
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Affiliation: | Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI; |
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Abstract: | The hydrogenated amorphous silicon (a-Si:H) thin-film transistors (TFT's) having a field-effect mobility of 1.45 ±0.05 cm2 /V·s and threshold voltage of 2.0±0.2 V have been fabricated from the high deposition-rate plasma-enhanced chemical vapor deposited (PECVD) materials. For this TFT, the deposition rates of a-Si:H and N-rich hydrogenated amorphous silicon nitride (a-SiN1.5 :H) are about 50 and 190 nm/min, respectively. The TFT has a very high ON/OFF-current ratio (of more than 107), sharp subthreshold slope (0.3±0.03 V/decade), and very low source-drain current activation energy (50±5 meV). All these parameters are consistent with a high mobility value obtained for our a-Si:H TFT structures. To our best knowledge, this is the highest field-effect mobility ever reported for an a-Si:H TFT fabricated from high deposition-rate PECVD materials |
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