| IC封装用覆铜板的研究 |
| |
| 引用本文： | 唐军旗,杨中强,曾宪平,孙鹏.IC封装用覆铜板的研究[J].绝缘材料,2010,43(5). |
| |
| 作者姓名： | 唐军旗 杨中强 曾宪平 孙鹏 |
| |
| 作者单位： | 广东生益科技股份有限公司,广东,东莞,523039 |
| |
| 基金项目： | 国家科技都支撑计划项目 |
| |
| 摘 要： | 研制了一种改性双马来酰亚胺树脂体系覆铜板(CCL),结果表明:制成的覆铜板具有玻璃化温度高、热膨胀系数小、模量高、介电常数低等优异的综合性能,可满足封装领域的技术需要,应用前景广阔。
|
| 关 键 词： | 双马来酰亚胺 覆铜板 IC 封装 |
A Copper Clad Laminate for IC Packaging |
| |
| TANG Jun-qi,YANG Zhong-qiang,ZENG Xian-ping,SUN Peng.A Copper Clad Laminate for IC Packaging[J].Insulating Materials,2010,43(5). |
| |
| Authors: | TANG Jun-qi YANG Zhong-qiang ZENG Xian-ping SUN Peng |
| |
| Affiliation: | TANG Jun-qi,YANG Zhong-qiang,ZENG Xian-ping,SUN Peng(Guangdong Shengyi Sci.Tech.Co.Ltd.,Dongguan 523039,China) |
| |
| Abstract: | A copper clad laminate(CCL) made of modified bismaleimide resin was studied.The results show that the CCL has good comprehensive properties of high glass transition temperature,ultra low coefficient of thermal expansion(CTE),high modulus and low dielectric constant(Dk),etc.The CCL has successfully been applied to IC substrate,which means a very promising prospect. |
| |
| Keywords: | bismaleimide copper clad laminate(CCL) IC packaging |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
