| 中板厂激光测厚系统测量终端的实现 |
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| 引用本文： | 芦亚伟. 中板厂激光测厚系统测量终端的实现[J]. 电气传动, 2000, 30(5): 50-53 |
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| 作者姓名： | 芦亚伟 |
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| 作者单位： | 邯郸钢铁股份有限公司中板厂 |
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| 摘 要： | 本文结合中板厂激光测厚仪的改造，介绍了激光测厚的单片机实现方法，提出了通过ＣＯＭ组件技术结合ＣＶＩ解决前后数据管理一致性的方法，并给出了具体的实现过程。并提出了中板厂现场总线控制方案。
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| 关 键 词： | 热轧 激光测厚系统 测量终端 中板厂 钢板 |
The Realizable Method of Thickness Measuring Instrument by Laser for Middle Plate Mill |
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| Lu Yawei. The Realizable Method of Thickness Measuring Instrument by Laser for Middle Plate Mill[J]. Electric Drive, 2000, 30(5): 50-53 |
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| Authors: | Lu Yawei |
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| Abstract: | In this paper,related to the reconstruction of control system for plate Mill,the realizable method of thickness measuring instrument by laser is introduced,the means of identity in database manage is bring forward with COM technilogy linking to CVI software,and idiographic process is given,and the Field Bus plan for factory network control is presented. |
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| Keywords: | measurring thickness by laser CVI curve fit COM field bus |
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