塑封半导体器件特殊封装缺陷的声学扫描检测

随着塑封器件质量与可靠性的提升，塑封器件在航空、航天、军用领域的应用越来越广泛。但是封装缺陷是塑封半导体器件常见的可靠性问题。声学扫描检测技术是一种基于超声波反射成像的无损检测技术，可以有效的检测塑封器件各类封装缺陷。简要介绍了塑封半导体器件内部材料、界面分层缺陷及相关失效机理，并基于裸露散热基板的塑封器件、无键合引线的塑封器件和BGA封装塑封器件的声学扫描检测实例，对声学扫描检测技术在塑封器件内部缺陷检测方面的应用进行了深入分析探讨，通过对比国军标和美军标的相关判据，对部分特殊的封装缺陷提出了合适的参考判据和检测依据。

Scanning acoustic inspection of unique plastic encapsulated semiconductor device package defects

With quality and reliability improvements, plastic devices are widely used in aviation, aerospace, and military industries fields. Package defects are common reliability issues of plastic encapsulated semiconductor devices. Scanning acoustic inspection is an effective non destructive testing method for plastic device package defects, which is based on ultrasonic reflection imaging technology. The material reliability, interface delamination, and corresponding failure mechanisms are introduced in this paper. The scanning acoustic inspections of exposed thermal pad construction, non wirebonding construction, and BGA package are discussed in the paper. The author presents the application precautions of scanning acoustic inspection technology for plastic package defects detection. The differences between GJB standards and MIL standards are also discussed. The author makes proper suggestion for package defect criteria.