| 微小型陶瓷管壳新工艺 |
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| 引用本文： | 陈银龙,王鲁宁,王子良,陈洁民,刘俊. 微小型陶瓷管壳新工艺[J]. 微纳电子技术, 1999, 0(2) |
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| 作者姓名： | 陈银龙 王鲁宁 王子良 陈洁民 刘俊 |
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| 作者单位： | 电子工业部第五十五研究所 |
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| 摘 要： | 采用超细９５％Ａｌ２Ｏ３粉料、高温烧结、陶瓷激光精密加工工艺制成的管壳，可满足毫米波器件的封装要求。
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| 关 键 词： | 微小型陶瓷封装 工艺 |
Miniceramic Package Developed by New Techniques |
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| Chen Yinlong,Wang Luning,Wang Ziliang,Chen Jiemin,Liu Jun. Miniceramic Package Developed by New Techniques[J]. Micronanoelectronic Technology, 1999, 0(2) |
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| Authors: | Chen Yinlong Wang Luning Wang Ziliang Chen Jiemin Liu Jun |
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| Abstract: | A miniceramic package with high strength and better hermetization was made by adopting superfine 95% Al 2O 3 powder,high temperature sintering and precise laser machining,which could meet the requirements of millimeter wave devices. |
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| Keywords: | Miniceramic package Technology |
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