Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy |
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Authors: | Yoshiharu Kariya Masahisa Otsuka |
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Affiliation: | (1) Graduate School, Shibaura Institute of Technology, Shibaura 3-9, 1088548 Tokyo, Japan;(2) Department of Materials Science and Engineering, Shibaura Institute of Technology, Shibaura 3-9, 1088548 Tokyo, Japan |
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Abstract: | Sn-3.5mass%Ag eutectic solder is selected as a candidate base alloy for replacing the eutectic Sn-Pb, and the effect of bismuth
(2, 5, 10mass%) on the fatigue life of bulk Sn-3.5mass%Ag eutectic at room temperature has been studied over the total strain
range from 0.3 to 3 percent in tension-tension mode. Fatigue life is defined as the number of cycles at which the load decreases
to a half of the initial value. The fatigue life dramatically decreases with increasing contents of bismuth and adding this
element over 2% makes fatigue life shorter than that of tin-lead eutectic alloy. Tensile strength of the alloy significantly
increases with an increase in bismuth contents due to solid solution hardening (<5%Bi) or dispersion strengthning of fine
bismuth particles, while ductility of this system dramatically decreases with increasing bismuth contents. Fatigue life of
these alloys depends on ductility obtained by tensile test. The fatigue life of Bi containing Sn-3.5%Ag alloys can be described
by, (Δεp/2D)·N
f
0.59
=0.66 where Nf is fatigue life defined by number of cycles to one-half load reduction, Δεp is the plastic strain range for initial cycles, D is the ductility as measured by reduction in area. |
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Keywords: | Coffin-Manson’ s law fatigue life isothermal fatigue lead-free solder mechanical properties Sn-Ag Sn-Ag-Bi |
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