| Sn-Ag-Bi系钎料焊接性能研究 |
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| 引用本文： | 龚代涛,刘晓波,王国勇. Sn-Ag-Bi系钎料焊接性能研究[J]. 电子元件与材料, 2003, 22(7): 26-29 |
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| 作者姓名： | 龚代涛 刘晓波 王国勇 |
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| 作者单位： | 四川大学金属材料科学与工程学院 四川成都610065(龚代涛，刘晓波)，四川大学金属材料科学与工程学院 四川成都610065(王国勇) |
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| 摘 要： | 讨论了电子软钎料的钎焊性能及其影响因素,钎料的钎焊性能很大程度取决于钎料对基板的润湿性能,而润湿性能与液态钎料在基板上的液、固、气三相界面张力有关。通过建立简化的数学模型,得出了润湿角与钎料熔滴铺展面积间的数学关系式。文中采用铺展面积法对Sn-Ag-Bi系钎料钎焊性能进行评估,结果表明在添加少量的Zn,可在一定程度上提高钎料的润湿性能,并可减少Bi的用量。
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| 关 键 词： | 无铅软钎料 钎焊性能 润湿角 铺展面积 |
| 文章编号： | 1001-2028(2003)07-0026-04 |
The Solderability of the Solder Based on Sn-Ag-Bi |
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| GONG Dai-tao,LIU Xiao-bo,WANG Guo-yong. The Solderability of the Solder Based on Sn-Ag-Bi[J]. Electronic Components & Materials, 2003, 22(7): 26-29 |
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| Authors: | GONG Dai-tao LIU Xiao-bo WANG Guo-yong |
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| Abstract: | The solderability of electronic solders and some factors that influence the solderability are discussed. The solderability depends, to a great extent, on the wettability, which is related with solid, liquid and gas interfacial tensions of the melted solders on substrates. The formula that expresses the relationship between the wetting angle () and spreading area (S) has set up by mathematical model. The solderability of the solder based on Sn-Zn-Ag was evaluate by the test method of spreading areas. The results indicated that the solderability of the solder has been improved by adding Zn. |
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| Keywords: | leadless solders solderability wetting angle spreading area |
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