| 塑封集成电路生产中前固化工艺研究 |
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| 引用本文： | 杨恩江. 塑封集成电路生产中前固化工艺研究[J]. 电子与封装, 2002, 2(6): 17-19 |
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| 作者姓名： | 杨恩江 |
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| 作者单位： | 天水永红器材厂技术处,甘肃,天水,741000 |
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| 摘 要： | 本文对几种在塑封集成电路封装中常用导电胶的前固化工艺进行了比较与探索,得出了一些具有实际意义的温度固化工艺曲线。
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| 关 键 词： | 集成电路封装 导电胶 固化 工艺曲线 |
| 修稿时间： | 2002-09-04 |
Research for Precure Process in Plastic IC production |
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| Yang En-jiang. Research for Precure Process in Plastic IC production[J]. Electronics & Packaging, 2002, 2(6): 17-19 |
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| Authors: | Yang En-jiang |
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| Abstract: | Several Kinds of precure processes in plastic packaging IC are compared and studied in this article.Moreover,the available process curves of temperature cure are also offered. |
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| Keywords: | IC Packaging Epoxy Cure Process curve |
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