自动楔焊键合第一键合点跟部损伤控制

在自动楔焊键合中，要提高键合引线的抗拉强度，最重要的一点就是要减小第一键合点跟部的损伤。文章简述了自动楔焊键合的工艺过程，分析了在自动楔焊过程中造成第一键合点跟部损伤的主要原因：劈刀本身结构会对键合引线造成一定的摩擦损伤，劈刀在键合第一点后垂直上升所产生的应力会对第一键合点根部造成损伤，键合引线在拉弧过程中也会造成键合引线摩擦受损，送线系统的张力也会对第一键合点根部造成一定的损伤。文中还讨论了如何尽量减小摩擦和应力对第一键合点跟部所造成的损伤。

Control of Automatic Wedge Bonding on First Bond Heel Crack

Reducing the first bond heel crack is the most important in improving the tensile strength of bonding wire in automatic wedge bonding. In the report,the technology process of automatic wedge bonding will be introduced,The main reason of first bond heel crack is analyzed in automatic wedge bonding,Bonding wire is abraded because of the structure of the wedge; the stress of the wedge raising after bonding the first bond will give crack to the heel of the first bond,the abrasive crack to the bonding wire may be in the tension of the bonding wire,the strain of the wire feed system will also damage the heel crack of the first bond wire. How to reduce the abrasion and strain which damage the first bond heel crack is discussed.