Corrosion of electrodeposited copper by exposure to volatile organic compounds

In this paper we investigate the corrosive behaviour of various volatile organic compounds (VOCs) on electroplated copper. The VOCs we considered were of the following types: (i) aromatic and substituted-aromatic compounds (benzene, toluene and ethyl benzene); (ii) a chlorine-substituted hydrocarbon (dichloromethane) and (iii) an aliphatic alcohol (isopropyl alcohol). Contamination by VOCs is typical of ULSI (Ultra Large Scale Integration) manufacturing environments, and exposure of Cu to VOC-contaminated clean room air has been pinpointed as a serious cause of interconnects failure. SEM observation highlighted corrosion signature that are typical of the different classes of molecules. In particular, the corrosion of copper is almost absent following exposure to isopropyl alcohol, very slow in the case of aromatic molecules and severe in the case of dichloromethane. The obtained results can be interpreted in terms of a crevice corrosion mechanism under droplets, enhanced by pitting in the presence of chlorinated solvents.