Quasi hermetic packaging for new generation of spaceborn microwave equipment

This paper presents the introduction of the quasi hermetic encapsulation of microwave hybrids for space application through different approaches evaluated at Thales Alenia Space – France. Thanks to the improvement for many years of microwave organic materials, it is now realistic to propose advanced packaging solutions like the chip on board approach with glob top encapsulation of active devices directly bonded on printed circuit boards for space applications. To validate this packaging approach, very significant reliability test-plans have been proposed and performed on the different technological processes and materials in agreement with standard space quality requirements. Results will be presented and a discussion on the nature of the stresses applied during the tests will be proposed.