Process research of high aspect ratio microstructure using SU-8 resist |
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| Authors: | J.?Liu author-information" > author-information__contact u-icon-before" > mailto:dyzljq@.com" title=" dyzljq@.com" itemprop=" email" data-track=" click" data-track-action=" Email author" data-track-label=" " >Email author,B.?Cai,J.?Zhu,G.?Ding,X.?Zhao,C.?Yang,D.?Chen |
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| Affiliation: | (1) The State Laboratory of Micro/Nanometer Fabrication Technology, Information Storage Research Center, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiao Tong University, Shanghai, 200030, PR China |
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| Abstract: | SU-8 is a negative, epoxy type, near-UV photoresist. This resist has been specifically developed for ultrathick, high-aspect-ratio MEMS-type applications using standard lithography equipment. However, in practice, SU-8 has shown to be very sensitive to process parameter variation. The orthogonal array was used in our experiments in order to improve the lithography quality and analyze the interaction among the parameters. The analyses show that the interaction between the exposure dose and post exposure bake has played an important role in adhesion between SU-8 resist and the substrate. The proposed process conditions are given. The output structure has straight sidewall profile, fine line and good space resolution. The aspect ratio is larger than 20. Moreover, several metallic films are used as substrates. The Ti film with oxidation treatment was found to have the strongest adhesion to the resist. The result will help to open possibilities for low-cost LIGA-type process for MEMS applications. |
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| Keywords: | UV-LIGA SU-8 resist Orthogonal array experiments High aspect ratio |
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